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Monroe CC Awarded $5M by DOD; ASMPT AMICRA, Teramount Collaborate on Silicon Photonics Packaging: Week in Brief: 09/29/23 | Business | Sep 2023

Monroe CC Awarded $5M by DOD; ASMPT AMICRA, Teramount Collaborate on Silicon Photonics Packaging: Week in Brief: 09/29/23 | Business | Sep 2023
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ASMPT AMICRA and Teramount Collaborate to Advance Silicon Photonics Packaging

ASMPT AMICRA a worldwide leading supplier of ultrahigh precision die attach equipment that specializes in ultrahigh precision die attach solutions and Teramount Ltd the leader in scalable fiber connectivity to chips today announced a collaboration to address the challenge of connecting fibers to silicon photonic chips to meet the evergrowing bandwidth demands in datacom and telecom applications.

Israel generalJohann weinhaendlerHesham tahaTeramount ltdBusiness wireSilicon photonicsManaging directorUniversal photonic couplerMass transfer printingMedia contactTeramount ltd asmpt amicra hesham taha collaborate silicon photonics packaging collaboration fiber connectivity chips supplier connecting fibers datacom telecom bandwidth fibertochip wafers dr johann weinhaendler optical optics data center computing sensors universal photonic coupler high precision die limited

ASMPT AMICRA And Teramount Collaborate To Advance Silicon Photonics Packaging

ASMPT AMICRA And Teramount Collaborate To Advance Silicon Photonics Packaging
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Israel generalJohann weinhaendlerHesham tahaTeramount ltdSilicon photonicsManaging directorUniversal photonic couplerMass transfer printing

ASMPT AMICRA and Teramount Collaborate to Advance Silicon Photonics Packaging

REGENSBURG, Germany, September 25, 2023 Close collaboration between Teramount and ASMPT AMICRA on fiber connectivity to silicon photonics chips

Israel generalJohann weinhaendlerHesham tahaBusiness wireSilicon photonicsManaging directorUniversal photonic couplerMass transfer printingTeramount ltdSilicon photonicsSmpt amicraFiber connectivityTelecom applications