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ADLINK’s two new modules, based on Intel® 13th Gen Core™ processors, feature advanced hybrid architecture with Performance and Efficient cores for optimized power usage o   Express-RLP: COM.0 R3.1 Type 6 module offering up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and extreme rugged option at 15/28/45W TDP o   COM-HPC-cRLS: COM-HPC Size C module with up to 24…

This week’s product, the Kontron VX3060-S2 3U VPX Rugged Blade PC, leverages the 11th Gen Intel Core processor for artificial intelligence (AI), CVGIP, and digital signal processing (DSP) workloads. Developed in alignment with the Sensor Open Systems Architecture (SOSA) Technical Standard, the VX3060-S2 serves demanding military programs with intensive processing and extreme ruggedization requirements.

As a Titanium member of the Intel® Internet of Things Solutions Alliance, AAEON strives to create elite embedded solutions by utilizing the most advanced technologies available. This is why AAEON are excited to present the BOXER-6645-ADS, the newest addition to AAEON’s line of fanless embedded box PCs powered by 12 Generation Intel® Core™ processors.

San Jose, California (PRWEB) March 08, 2022 -- Summary: • Two new modules (COM-HPC-sIDH Server Type module and Express-ID7 Type 7 module) featuring Intel®

ADLINK Technology Inc., a global leader in edge computing, introduces its latest Intel® Xeon® D-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Server Type and COM Express Type 7. Powered by Intel® Xeon® D-2700 and D-1700 series processors (Codename: Ice Lake-D), these ADLINK COMs feature integrated high speed Ethernet, up to 8x 10G or above with up to…

Adlink has added Intel Xeon D processors to two computer-on-module form-factors: COM-HPC size-D and COM Express Type 7. They are the Ice Lake-D D-2700 and

Typical customers for the new range of Computer-on-Modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction equipment, agricultural vehicles, self-driving robots and many other mobile applications in demanding outdoor and off-road environments.

Portwell, a world-leading innovator for Industrial PC (IPC) and embedded computing solutions, and an IoT Solutions Titanium Partner of the Intel Partner Alliance, announces the release of the PCOM-B645VGL, a COM Express Type 6 Compact (95mm x 95mm) module based on the 10nm Intel Atom x6000E Series/Pentium/Celeron Processors (formerly Elkhart Lake platform).

11th Gen Intel Core congatec modules with soldered RAM congatec, a specialist in embedded and edge computing technology, has introduced a new 11th Gen Intel Core processor based Computer-on-Module with soldered RAM providing shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportati...

conga-TCA7 - High-performance Intel® UHD Graphics (Gen11) - Options for Industrial Temperature Range -40°C to 85°C - Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability - Up to 3.200 MT/s DDR4 SODIMM Memory Support with Inband ECC Folgen Sie uns auf: Copyright © 2021 Vogel Communications Group Diese Webseite ist eine Marke von Vogel Communications Group. Eine Übersicht von allen Produkten und Leistungen finden Sie unter www.vogel.de F...