Page 143 - Tower Semiconductor News Today

iToF technology platform for 3D imaging and face recognition applications Tower Semiconductor and OPIX, a supplier of 3D Time-of-Flight (ToF) image sensor solutions, have jointly developed an iToF technology platform for 3D imaging and face recognition. The platform features multiple depth sensing and distance measurement applications for a broad range of markets, based on Tower’s state of the art, pixel level wafer stacking BSI technology. The technology is impleme...

Tower Semiconductor and OPIX Announce the Successful Development of a World Class iToF Technology Platform for 3D Imaging and Face Recognition Applications GlobeNewswire         Featuring state of the art performance including multiple depth sensing and distance measurement applications for a broad range of fast-growing markets such as mobile, AR/VR, retail, robotics, and automation Based on Tower’s leading-edge pixel-level stacked wafer BSI technology with enhanced N...

UMC forecast to become worlds No. 3 contract chipmaker 12/12/2020 07:48 PM CNA file photo Taipei, Dec. 12 (CNA) Taiwan-based contract chipmaker United Microelectronics Corp. (UMC) is expected to rise one place in the global rankings in the fourth quarter of this year to No. 3, as its revenue soars on strong demand for its 8-inch wafers, according to a research institute run by the market information advisory firm Trendforce. UMC will replace American rival GlobalFoundries Inc. as the third larg...