Evertiq - Wafer Back-End Services at AEMtec - a closed loop for you...
AEMtec offers their customers Back-End production stages from wafer to complex micro and optoelectronic module assembly, from one source. Some time ago AEMtec expanded the Wafer Back-End Services by introducing the electroless Under Bumb Metallization (UBM) and the Solder Balling processes. Significantly shorter delivery times, less workload and lower interface losses were achieved. Time-consuming intermediate steps have been eliminated. Steps that are outsourced in the typical industrial proces...
Aemtec Gmb Mend Services Wafer Services Aemtec Wafer Back End Services Under Bump Metallization Solder Balling
Source: evertiq.com