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RIT becomes partner in national semiconductor center based at Cornell University

The Pentagon s Quest for Academic Intelligence: (AI)

Inside DARPA s latest effort to overhaul chip fabrication

Inside DARPA s latest effort to overhaul chip fabrication
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Semiconductor packaging integration center opened

Penn State leads semiconductor packaging, heterogeneous integration center

The Semiconductor Research Corporation’s Joint University Microelectronics Program 2.0, a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency, has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems.

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