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STRATFORD, Conn. SAN DIEGO Athletic Brewing Announces One of the Nation s Largest Trail Grants Ever as Part of Its Ongoing Two for the Trails Program Source: Athletic Brewing
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ASE Wins Sustainability Award
SUNNYVALE, Calif. (BUSINESS WIRE) Apr 6, 2021
Advanced Semiconductor Engineering, Inc. (ASE) announced today that it has received the 3D InCites 2021 Sustainability Award. This inaugural award honors exemplary achievement in reducing greenhouse gas (GHG) emissions, energy use, water use, and waste to landfill and recognizes the long-term, stringent sustainability goals put in place for the decade ahead.
The 3D InCites Sustainability Award Selection Committee comprised experts in the field, whom did their due diligence in applying criteria to five finalists, all leading players from across the semiconductor ecosystem. The following criteria was considered, and the committee looked both at progress to date and future goals:
Siemens, ASE Introduce Enablement Technologies for Next-Gen High Density Advanced Package Designs
Siemens Digital Industries Software has announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.