Substrate Integrator News Today

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated…

Siemens Digital Industries Software says its  Calibre Platform tool for IC design verification and its  Analog FastSPICE (AFS) platform for analogue, RF,

Siemens Digital Industries Software and UMC are to develop and implement a new multi-chip 3D IC planning, assembly validation and parasitic extraction

Siemens, ASE Introduce Enablement Technologies for Next-Gen High Density Advanced Package Designs Siemens Digital Industries Software has announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, dat...