Capacity leaders in each wafer size
It is not surprising that the 300mm ranking includes only DRAM and NAND flash memory suppliers like Samsung, Micron, SK Hynix, and Kioxia/WD; four of the world’s largest pure-play foundries TSMC, GlobalFoundries, UMC, and Powerchip (including Nexchip); and Intel, the industry’s biggest manufacturer of microprocessors.
TSMC has the largest capacity in the main wafer sizes, with Intel No.6 in 12 inch and ST No.2 in 8 inch and No.5 in the ≤150mm category, reports IC Insights in its
Global Wafer Capacity 2021-2025 report. Infineon is No.4 in eight inch.
Figure 1. compares the relative amounts of capacity held by the top 10 leaders.
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