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COLLEGE PARK, Md. The U.S. Army plans to cooperate in artificial intelligence research with teams led by the University of Maryland, College Park and in partnership with the University of Maryland, Baltimore County. The cooperative agreement brings together a collaborative of nearly 30 diverse experts in engineering, robotics, computer science, operations research, modeling and simulation, and cybersecurity.
With the Army s goal of seeking transformational advances in artificial intelligence and autonomy, Army and academic officials said this partnership will accelerate the development and deployment of safe, effective and resilient capabilities and technologies, from wearable devices to unmanned aircraft, that work intelligently and in cooperation with each other and with human actors across multiple environments.
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New Delhi: Indian Scientists have developed a multifunctional heat sink enabled by 3D printing, which can dissipate heat from mechanical devices at 50 percent enhanced rate compared to conventional sinks.
Existing approaches for heat exchanging and heat sink achieve different functions using dedicated units. In the new technology, multiple functions have been integrated together in a single unit. It can also be used to develop heat pipes, vapour chambers, heat exchangers and noise reducing heat sinks.
The technology enabled by 3D printing in combination with electroplating was developed to withstand load while dissipating heat by Dr Shankar Krishnan, Associate Professor Department of Mechanical Engineering, IIT Bombay with support from the Department of Science & Technology, Government of India under the ‘Make in India’ initiative. He has also filed a national patent on ‘noise reducing heat sinks’ and international patent will be applied subsequently. Experimental as