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Siemens and SAP Expand Partnership to Deliver Intelligent Service and Asset Lifecycle Management Solutions

Siemens and SAP Expand Partnership to Deliver Intelligent Service and Asset Lifecycle Management Solutions
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Siemens and SAP Expand Partnership to Deliver Intelligent Service and Asset Lifecycle Management Solutions

Siemens and SAP Expand Partnership to Deliver Intelligent Service and Asset Lifecycle Management Solutions
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The First Emulators of Spring

New Capabilities Address Verification Challenge by Kevin Morris It’s the season of rebirth. The sun is out. Flowers are in bloom. Birds busily build nests while semiconductor verification teams emerge from their long winter hibernation, ready to tool up for the challenges of the next process generation. Billions of unverified gates give shelter to countless bugs awaiting anxious design teams as they prepare for summer’s tape-outs and struggle to bring new software up on wobbly legs. Yep, the first emulators and prototyping platforms of spring have arrived, and – failing to be greeted with their own shadows – engineers are rejoicing at the prospect of more productive, efficient, and effective verification of their next crop of chip designs.

Fujitsu Embarks on Partnership with Siemens Digital Industries Software Strengthening Global Competitiveness and Accelerating DX to Realize Smart, Sustainable Manufacturing

(1) TOKYO, Apr 12, 2021 - (JCN Newswire) - Fujitsu today announced an agreement to collaborate with Siemens Digital Industries Software to enhance competitiveness for its customers and strengthen and accelerate Digital Transformation (DX) in the manufacturing industry beginning with the Japanese market. Through this collaboration, Fujitsu will initially resell industry-specific solutions from Siemens Xcelerator portfolio in the Japanese market, including Siemens Product Lifecycle Management System Teamcenter (1) and Manufacturing Operation Management System Opcenter (2), while providing solutions that draw on these capabilities in combination with Fujitsu s brand of manufacturing solutions and services, COLMINA. With the technical support of Siemens, Fujitsu is additionally developing 3D-BOP(3) functions that seamlessly link design and assembly processes to shorten time to market and improve productivity and quality.

Siemens introduces PCBflow

Siemens introduces PCBflow Siemens has introduced PCBflow, a cloud-based software solution which looks to bridge the gap between the electronics design and manufacturing ecosystems. PCBflow extends Siemens’ Xcelerator portfolio with a secure environment for printed circuit board (PCB) design teams to interact with a variety of manufacturers, performing a range of design-for-manufacturing (DFM) analyses in the context of each manufacturers’ process capabilities and so speeding up the design-to-production handoff. Powered by the Valor NPI software engine, which can perform over 1000 DFM checks, PCBflow enables PCB design teams to rapidly identify manufacturability violations. These violations are then sorted and prioritised according to level of severity, guiding users through images and locations on the design for easy identification and immediate correction.

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