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ARMONK, N.Y., Feb. 24, 2021 /PRNewswire/ Siemens, IBM (NYSE: IBM) and Red Hat today announced a new collaboration that will use a hybrid cloud designed to deliver an open, flexible and more secure solution for manufacturers and plant operators to drive real-time value from operational data. In one month, a single manufacturing site can generate more than 2,200 terabytes of data according to a report by IBM – yet most data goes unanalyzed.
Through the joint initiative, Siemens Digital Industries Software will apply IBM s open hybrid cloud approach, built on Red Hat OpenShift, to extend the deployment flexibility of MindSphere®, the industrial IoT as a service solution from Siemens. This will enable customers to run MindSphere on-premise, unlocking speed and agility in factory and plant operations, as well as through the cloud for seamless product support, updates and enterprise connectivity.
Matthew Ballance to Receive Accellera Systems Initiative Technical Excellence Award
Siemens’ Ballance will be honored during virtual DVCon U.S. 2021 for his contributions to the development of the Portable Test and Stimulus Standard
Elk Grove, Calif., February 23, 2021 Accellera Systems Initiative (Accellera) announced today that Matthew Ballance, a member of the Portable Stimulus Working Group and a Product Engineer and Portable Stimulus Technologist with Siemens Digital Industries Software, is the recipient of the 2021 Accellera Technical Excellence Award. The award was established to recognize the outstanding achievements of an individual among Accellera’s working group members and their significant contributions to the development of its standards.
/PRNewswire/ Based on its recent analysis of the global digital transformation market, Frost & Sullivan recognizes Siemens Digital Industries Software.
Siemens, ASE Introduce Enablement Technologies for Next-Gen High Density Advanced Package Designs
Siemens Digital Industries Software has announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.