AMD's 3D V-Cache chiplet tech enters production later this year on June 1, 2021, 11:15 In brief: AMD caught everyone off guard at Computex 2021 with a demonstration of its new 3D chiplet technology that looks to deliver the type of performance gain you’d typically see with a new process node or microarchitecture. Developed in collaboration with TSMC, AMD’s first application of the 3D chiplet tech is a vertical cache addition for its high-end processors. In a nutshell, AMD used a process called through-silicon vias (TSVs) to stack additional L3 cache on top of the compute chiplets. AMD CEO Dr. Lisa Su showed off a prototype Ryzen 5000 CPU with one of two chiplets featuring the added stacked cache. As AnandTech highlights, the difference is obvious compared to the standard chiplet. The 3D V-Cache die is not as large as the core die, so AMD added additional structural silicon for support. Both dies were also thinned, meaning AMD doesn’t have to change up its heatspreader design.