ASE intros FOCoS-Bridge for AI and HPC chips : vimarsana.com

ASE intros FOCoS-Bridge for AI and HPC chips

Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm package containing two ASICs and eight HBM devices connected by eight silicon bridges.

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, Semiconductor Engineering , Asics , Advanced Semiconductor Engineering , Ai , Ai Chips , Tse , Chiplet , Ships , Hips Components , Pc , C Manufacturing , Emiconductor , Ilicon ,

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