BSU Updates High-Performance X-ray Inspection Capability BSU Inc., a growing EMS company, has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc. In making the announcement, Dennis Leahy, VP of Sales and Customer Success, said, “We will continue to incorporate X-ray technology as a standard offering in our build process here at BSU. Our XT V 160 provides high-resolution to ensure compliance with our stringent quality standards. Each board is examined at varying levels/angles, and the images are saved to become part of the manufacturing records for our customers. This provides the opportunity for us to recommend design and build efficiencies.”