Sponsored by Metrohm AGMar 12 2021 A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the digital age and the current rise of the ‘Internet of Things.’ Grown silicon ingot material has to undergo several processes in order to produce silicon semiconductor devices, including cutting, shaping, polishing and cleaning for further processing. Polishing creates surface planarity necessary for future lithographic steps and so is a key step in order to obtain high quality silicon wafers. One of the primary technologies for polishing or smoothing the silicon wager surface is Chemical Mechanical Planarization or CMP.