Although TSMC's 3nm process has already achieved mass production, its capacity utilization rate is not yet filled. Chen Liang-chia, a distinguished professor of the mechanical engineering department at National Taiwan University (NTU), stated that more advanced processes have extremely high production costs, and yield rates are also an issue. To address these issues, Chen mentioned a better through-silicon via (TSV) technology developed by his team that could be one of the solutions.