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Intel 3D Stacked CMOS Transistors Combine Backside Power & D
Intel 3D Stacked CMOS Transistors Combine Backside Power & D
Intel 3D Stacked CMOS Transistors Combine Backside Power & Direct Backside Contact To Deliver Increased Performance & Scaling For Next-Gen Chips
Intel showed 3D Stacked CMOS Transistor technology, utilizing backside power & direct backside contact to deliver more performance & scaling.
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