Intel Details 3D Chip Packaging Tech for Meteor Lake, Arrow

Intel detailed its 3D Foveros chiplet packaging technology for its Meteor Lake, Arrow Lake and Lunar Lake processors at Hot Chips 34.

Related Keywords

, Ponte Vecchio , Pat Gelsinger , Ponte Vecchio Gpus , Agilex Fpgas , Redwood Cove , Lakefield Foveros , D Foveros Base , Intel , Meteor Lake , Arrow Lake , Lunar Lake , Hot Chips , While Intel , Rialto Bridge , Foveros Base ,