Molex Scales Deployments of High-Speed Interconnect Solution

Molex Scales Deployments of High-Speed Interconnect Solutions to Meet Next-Generation Hyperscale and Enterprise Data Center Demands


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LISLE, Ill., April 29, 2021 /PRNewswire/ -- Molex, a leading global connectivity and electronics solutions provider, is scaling global deployments of its high-speed copper and optical interconnects and modules to help customers better address demands for higher bandwidth. Molex's broad portfolio of next-generation connectivity solutions leverage the latest advancements in copper and optics to deliver high signal integrity, lower latency and reduced insertion loss for optimal efficiency, speed and density.
Example of Molex BiPass technology delivering best in class signal integrity
Gartner expects end-user spending on global data center infrastructure to reach $200 billion this year, as large enterprise facilities resume expansion while hyperscalers continue to expand globally. Additionally, skyrocketing demand for bandwidth-intensive, data-driven services, which accelerated during COVID-19, is fueling a rise in compute, data storage and networking capabilities. To keep pace, companies are moving from monolithic data center designs to distributed and disaggregated architectures, which creates significant connectivity challenges.

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