MZ Technologies Rolls Out New Technology Roadmap News provided by Share this article Share this article ROME, July 29, 2021 /PRNewswire/ -- MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIO™ IC/package co-design tool. GENIO™ became the first commercially available IC/package co-design tool when MZ Technologies began taking order in August, 2020. The roadmap calls for additional features to the current tool set. Expected in the first quarter of next year is availability of a parasitic estimation capability and stack planning support. The MZ Technology Roadmap calls adding six new features to the GENIO IC/ Packaging Co-Design Tool over the next 18 months and identifies plans for a GENIO 2.0 version sometime in 2023.