New Electronics - Up-front processing : vimarsana.com
New Electronics - Up-front processing
In mainstream computing, 3D integration is still a novelty, restricted to large, fast memories for high-end graphics processing units and mobile devices that need to trade manufacturing cost for space.
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Hong Kong, Shenzhen, Guangdong, China, Xperia Xzs, Donhee Ham, Carver Mead, Misha Mahowald, University Of Washington, Hong Kong Polytechnic University, California Institute Of Technology Caltech, Harvard University, Paulson School, Applied Sciences, California Institute, Hong Kong Polytechnic,