vimarsana.com
Home
Live Updates
Nvidia to embrace TSMC 3D SoIC tech : vimarsana.com
Nvidia to embrace TSMC 3D SoIC tech : vimarsana.com
Nvidia to embrace TSMC 3D SoIC tech
Nvidia is expected to use 3D (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market.
Related Keywords
,
Nvidia ,
2025 ,
D ,
Wmd ,
Chiplet ,
Ships ,
Hips Components ,
C Design ,
Distribution ,
C Manufacturing ,
Oic ,
Smc ,