Nvidia to embrace TSMC 3D SoIC tech : vimarsana.com

Nvidia to embrace TSMC 3D SoIC tech

Nvidia is expected to use 3D (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market.

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, Nvidia , 2025 , D , Wmd , Chiplet , Ships , Hips Components , C Design , Distribution , C Manufacturing , Oic , Smc ,

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