Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielet

Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielets and Heterogeneous Integration," Subramanian S. Iyer, Prof. EE, UCLA | Electrical and Computer Engineering

Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielets and Heterogeneous Integration," Subramanian S. Iyer, Prof. EE, UCLA | Electrical and Computer Engineering
ucsb.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from ucsb.edu Daily Mail and Mail on Sunday newspapers.

Related Keywords

Bombay , Maharashtra , India , Subramanians Iyer , Charlesp Reames , Moore Dennard , Luke Theogaragan , Danielc Hughes Jr , University Of California At Los Angeles , Electrical Engineering Department , Engineering Department , Ibm , National Academy Of Inventors , Distinguished Professor , Endowed Chair , Materials Science , Heterogeneous Integration , Performance Scaling , Distinguished Lecturer , National Academy , Distinguished Alumnus , Noble Medal ,