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Punjab Engineering College signs MoU with Cadence to provide
Punjab Engineering College signs MoU with Cadence to provide
Punjab Engineering College signs MoU with Cadence to provide VLSI training
Punjab Engineering College (Deemed to be University) and Cadence Design Systems (India) have signed a Memorandum of...
Related Keywords
India ,
Baldev Setia ,
Jaswinder Ahuja ,
Jyoti Kedia ,
Vijayakumarc Patil ,
Semicon India Future Skills Talent Committee ,
Punjab Engineering College ,
Head Of The Electronics ,
Application Engineering Group ,
Engineering College ,
Cadence Design Systems ,
Application Engineering Group Director ,
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India Managing Director ,