Samsung Electronics: Next Generation 2.5D Integration Solution ‘I-Cube4’ Available Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again. Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package. Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.