Samsung wins advanced chip packaging order from NVIDIA for A

Samsung wins advanced chip packaging order from NVIDIA for AI GPUs, TSMC isn't enough

Samsung has won NVIDIA as a customer for advanced 2.5D packaging, with the company providing its interposer and I-Cube to NVIDIA for AI GPUs.

Related Keywords

South Korea , , Nvidia , Samsung , Advanced Package , High Bandwidth Memory ,

© 2025 Vimarsana