vimarsana.com
Home
Live Updates
Using Surface Characterization to Control Epoxy Die Bonding
Using Surface Characterization to Control Epoxy Die Bonding
Using Surface Characterization to Control Epoxy Die Bonding
This article describes the characterization of the epoxy die attachment process, its accuracy and its importance for stability.
Related Keywords
Maria Osipova ,
Polytec Topmap ,
Flexible Electronics ,
Surface Characterization ,
Control Epoxy Die ,
Quad Flat No Leads ,
Line Thickness ,
Layer Thickness Measurement ,
Grid Array ,
Expoxy Die ,
Pond ,
Measurements ,