Winbond TrustME® W77Q Secure Flash Obtains SESIP Level

TAICHUNG, Taiwan—2022-5-31— Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the Company’s TrustME® W77Q Secure Flash had obtained Security Evaluation Standard for IoT Platforms (SESIP) Level 2 with Physical Attacker Resistance Certification. This is the first certification using GlobalPlatform® SESIP Profile for Secure External Memories, and NIST 8259A (IoT device cybersecurity capability core baseline).…

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