Winbond's Successful Interoperability of OctalNAND Flash wit

Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution – EEJournal


July 21, 2021
Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
Solution optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile and IoT SoCs
Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gbit.

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