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S Narayan's 5D Leaves Fans Excited Ahead Of Release; To Deliver A Powerful Message - Vimarsana News

S Narayan's 5D Leaves Fans Excited Ahead Of Release; To Deliver A Powerful Message

The film 5D by S. Narayan is creating anticipation with its intense storyline.

VFX Breakdown: BlueBolt Creates 1793 'Napoleon' Battlegrounds - Vimarsana News

VFX Breakdown: BlueBolt Creates 1793 'Napoleon' Battlegrounds

Studio delivered 126 VFX shots to help realize Ridley Scott’s vision of Napoleon’s 1793 Siege of Toulon and his violent suppression of the Paris riots two years later. 

Source: awn.com
Hilariously Violent Game in Development from 'Salad Fingers' Creator - Vimarsana News

Hilariously Violent Game in Development from 'Salad Fingers' Creator

David Firth, the king of creepy and outlandish animation from the early internet, is creating a 2.5D PC game based on Jerry Jackson, a foul-mouthed teen character from one of his lesser-known animations, focusing on the concept of a completely breakable environment.

Source: awn.com
MSNBC Morning Joe March 22, 2022 10:49:00 - Vimarsana News

MSNBC Morning Joe March 22, 2022 10:49:00

Since 2020 and first deaths of the year. the fifth wave of the virus confirmed cases soaring to highest levels since start of the pandemic. now the city seen its health system overwhelmed, containment efforts abandoned. a mass exodus of people and its embattled leadership looking increasingly likely to be replaced. russia's problems in trying to subdue ukraine might have thrown a wrench into chinese planning to take military action against taiwan. the west coming together quickly likely a warning to china what it might face should it decide to invade taiwan and the ukrainian resistance has sho...

GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs - Vimarsana News

GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT).