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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Advanced Electronics Assembly Conference taking place on November 9, 2023, at the Radisson Blu Beke Hotel in Budapest, Hungary.
Teledyne e2v Develops Space Computing Reference Design featuring Microchip's Radiation-Tolerant Gigabit Ethernet PHYs
Teledyne e2v is developing a fully radiation-tolerant (RT) space computing reference design, enabling high-speed data routing in space applications. Based
Roberta Talarico Galeno Cavalcanti, Application Engineer, Mitsubishi Bachelor of Science in Electrical Engineering, Centro Universitário da FEI, Brazil
Kristen Gallett, Application Engineer, B&R Industrial Automation Bachelor of Science in Mechanical Engineering Purdue University Kristen Gallett