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Taiwan Semiconductor Industry Development Highlights, 2Q

Dublin, Oct. 11, 2023 (GLOBE NEWSWIRE) The

Hsin pei shihChipbond technologyDevelopment highlights of taiwan semiconductor industrySemiconductor manufacturingPowerchip semiconductorWinbond electronicsAnpec electronicsOutsource semiconductor assemblyApplications drive development of advanced packaging technologiesSemiconductor sales performance under inventory pressureGeneralplus technologyMicron technologyRealtek semiconductorNuvoton technologyKing yuan electronicsPhison electronics

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