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New Electronics - Cadence expands collaboration with Samsung Foundry to advance 3D-IC design - Vimarsana News

New Electronics - Cadence expands collaboration with Samsung Foundry to advance 3D-IC design

Cadence Design Systems, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), has expanded its collaboration with Samsung Foundry to accelerate 3D-IC design.

New Electronics - Cadence Certus now delivers up to 10X faster concurrent full-chip optimisation and signoff - Vimarsana News

New Electronics - Cadence Certus now delivers up to 10X faster concurrent full-chip optimisation and signoff

Cadence Design Systems has announced the new Certus Closure Solution that looks to address growing chip-level design size and complexity challenges.

New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff - Vimarsana News

New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff

Highlights: • Provides customers with a first-of-its-kind fully automated environment featuring a massively parallel and distributed architecture • Supports design optimization and signoff with unlimited capacity, delivering overnight turnaround time while significantly reducing design power • Cloud-ready solution advances emerging design areas, including hyperscale computing, 5G communications, mobile, automotive and networking SAN JOSE, Calif., October…

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies - Vimarsana News

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies

SAN JOSE, Calif., Oct. 27, 2021 -- Highlights: The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning,

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs - Vimarsana News

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…