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Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process - Vimarsana News

Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process

Highlights: • Certified Cadence flows are production-ready, and design IP is readily available for customers looking to create Intel 16 designs now • Customers can confidently deliver a wide variety of HPC, consumer and USMAG applications based on the Cadence-certified flows SAN JOSE, Calif., July 12, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced…

Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process - Vimarsana News

Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process

Highlights: Certified Cadence flows are production-ready, and design IP is readily available for customers looking to create Intel 16 designs now Customers can confidently deliver a wide variety of HPC, consumer and USMAG applications based on the Cadence-certified flows

Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions - Vimarsana News

Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions

Cadence today announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex®-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis™-G720, Mali™-G720 and Mali-G620 GPUs.

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow - Vimarsana News

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow - Vimarsana News

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023