UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
Winbond, Faraday, ASE, and Cadence comprise project members to provide a one-stop platform for customers’ stacked silicon needs ...
Source: marketscreener.com
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JFF+INDEPENDENT CINEMA 2023
Introducing the current state of Japanese cinema culture with a focus on mini theatersDuration: Today - 31 October 2023, 15:00 (Thailand time)Languague: Japanese soundtrack with Thai, English, Spanish (Latin America), Indonesian, Chinese
Source: newswit.com
New Electronics - 3D-IC hybrid bonding reference flow collaboration
United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies.
Source: newelectronics.co.uk
UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…
Source: eejournal.com
UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023
Source: marketscreener.com