New Electronics - 3D-IC hybrid bonding reference flow collab

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies.

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Osbert Cheng , Don Chan , Digital Signoff Group At Cadence , Signoff Group , Innovus Implementation System , Quantus Extraction Solution , Tempus Timing Signoff Solution , Pegasus Verification System , Integrity Solution , Celsius Thermal Solver ,