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Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions

Cadence today announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex®-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis™-G720, Mali™-G720 and Mali-G620 GPUs. ....

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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard
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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard – Consumer Electronics Net

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard – Consumer Electronics Net
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