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Alchip Technologies today revealed that the company presented a paper at the TSMC 2023 Taiwan Open Innovation Platform® Ecosystem Forum showcasing its ground-breaking collaborative advanced artificial intelligence (AI) 3DIC chiplet design and integrated IP methodology.
Taipei, Taiwan, December 13, 2023 – Alchip Technologies today revealed that the company presented a paper at the TSMC 2023 Taiwan Open Innovation Platform® Ecosystem Forum showcasing its ground-breaking collaborative advanced artificial intelligence (AI) 3DIC chiplet design and integrated IP methodology. The paper, entitled "A Case Study Demonstrating the Advantages of 224G Interconnects and 3DIC…
Showcases packaging and IP integration for next-gen AI functionalityTaipei, Taiwan, Dec. 13, 2023 -- Alchip Technologies today revealed that the company presented a paper at the TSMC 2023 Taiwan...