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3D-Circuits – Enabling 3D-Placement Of Electronic Components - Vimarsana News

3D-Circuits – Enabling 3D-Placement Of Electronic Components

Modern electronic assemblies are becoming more and more complex with an increasing number of components. This makes it difficult to fit all parts into the limited space available for printed circuit boards (PCBs). To meet these challenges, engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging.…

Biofuel Bunker Trial for NYK Wood Chip Carrier in Japan - Vimarsana News

Biofuel Bunker Trial for NYK Wood Chip Carrier in Japan

The Daio Austral, operated by NYK and carrying wood chips for the Daio Paper Corporation, took on a biofuel bunker blend at Kinuura on June 22.