Page 35 - Chip Design News Today : Breaking News, Live Updates & Top Stories | Vimarsana

PASCAGOULA, Miss., May 27, 2021 (GLOBE NEWSWIRE) -- Huntington Ingalls Industries’ (NYSE: HII) Ingalls Shipbuilding division announced today that Brian Blanchette has been promoted to vice president of quality and engineering. Blanchette will be responsible for the management and oversight of the division’s quality program as well as all ship design, engineering, integrated logistics support and planning yard engineering efforts. He will relieve Dave Belanger upon his retirement in July. “Throughout his 25-year career at Ingalls, Brian has served in a variety of diverse ro...

Efabless launches chipIgnite with SkyWater Efabless, a community chip creation platform, has launched its new chipIgnite program to extend chip design and fabrication and a collaboration with SkyWater Technology for the first node supported in the program. The chipIgnite program expands upon the SKY130-based open source chip manufacturing program sponsored by Google and supports private commercial designs that include non-open source IP. This initiative is being seen as another step forward in the industry to broaden access to chip design by giving people the ability t...

Summary Khursheed Aurangzeb is Associate Professor in Department of Computer Engineering at College of Computer and Information Sciences at King Saud University (KSU), Riyadh, Saudi Arabia. He received his Ph.D. degree in Electronics Design from Mid Sweden University Sweden in June 2013, MS degree in Electrical Engineering (System on Chip Design) from Linkoping University, Sweden in 2009. He received his B.S. degree in Computer Engineering from COMSATS Institute of Information Technology Abbottabad, Pakistan in 2006. He has authored and co-authored more than 70 publications including IEEE / A...

Share: Aims to further deepen Chip Design and ASIC engineering capabilities and global presence Tessolve, a Hero Electronix venture and a global provider of engineering and R&D services to semiconductor companies, has raised $40 million from Novo Tellus Capital Partners, a leading private equity firm based out of Singapore at a $100 million valuation. The funding will be used by Tessolve to drive further growth through acquisitions and organic investments. Since a majority investment by Hero Electronix in 2016, Tessolve has witnessed a year-on-year growth rate of over 30% achieving $75M in 2...

The deal is opposed by Big Tech, and the rise of RISC-V adoption is a threat for Arm Holdings