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Universal Chiplet Interconnect Express seeks to unify future semiconductor packages

What challenges would a non-unified chiplet industry present, what is UCIe, and will it help accelerate future semiconductor developments? ....

Chiplet Interconnect Express ,

Samsung, Intel and TSMC join hands for next-gen chip packaging tech

To set a industry standard for chip packaging and stacking, giants like Samsung, TSMC, Intel, Meta, Microsoft, and others are forming a consortium. - SamMobile ....

Technology Holding , Nikkei Asia , Google Cloud , Chiplet Interconnect Express ,

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. ....

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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
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Partha Ranganathan , Rachael Watson , Mandy Rose , Vijay Rao , Mark Papermaster , Leendert Van Doorn , Lihong Cao , Sandra Rivera , Lee Chung Lu , Edward Tiedemann , Intel Corporation , Technology Platform , Memory Product Planning Team At Samsung Electronics , Data Center , Qualcomm Incorporated , Microsoft Corporation , Link Consortium , Qualcomm Technologies Inc , Base Inc , Ucie Consortium , Directory Of Technology , Taiwan Semiconductor Manufacturing Company , Semiconductor Engineering Inc , Leaders In Semiconductors , Cloud Service Providers Join Forces , Standardize Chiplet ,