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The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express. Featuring an innovative performance hybrid architecture, the new high-end embedded processors, formerly codenamed Alder Lake, are more than just another next generation of Intel Core i9, i7, i5, or i3 processors. So, what makes the difference? And what can engineers of next-generation high-end embedded and edge appliances expect from these new modules?

Congatec has unveiled its first modular Micro-ATX compliant carrier board with COM-HPC interface.

Congatec is aiming at high-end industrial workstations and desktop clients with a Micro ATX-compliant carrier board with a COM-HPC interface - avoiding

Congatec has introduced seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules.

Highly powerful, yet passively cooled