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DFI has unveiled a “TGU171/TGU173” thin Mini-ITX board with 2.5GbE, 2x GbE, 4x USB 3.2 Gen2, 2x DP++, and 2x M.2, as well as Compact Type 6 “TGU968” and Mini Type 10 “TGU9A2” modules, all based on 11th Gen CPUs.
More power for low power 24/7 systems San Diego, CA, 2 March 2021 * * * congatec – a leading vendor of embedded and edge computing technology – introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance has been validated using real-world cross-platform test suite Cinebench R...
310 Views congatec – a leading vendor of embedded and edge computing technologies – announces launch of 12 brand new Computer-on-Modules in parallel with today’s Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance (1) along with state-of-the-art PCIe Gen4 and USB4 support. The new congatec COM-HPC and COM Express Computer-on-Modules will accelerate many performance hungry fanless edge applications in har...