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Unlock the Future of Electronics Manufacturing: Gen3 and Zestron Workshop

Unlock the Future of Electronics Manufacturing: Gen3 and Zestron Workshop
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Ventec's PCB Base Material Solutions at electronica India

Ventec's PCB Base Material Solutions at electronica India
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Chris Hanson , Ventec International Group Co Ltd , Ventec International , India Expo Mart , Conductive Anodic Filament , Insulated Metal Substrate ,

IPC's Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

IPC's Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG
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Bev Christian , Dave Hillman , Dieter Bergman , Patty Goldman , Mechatronics Engineering Of The University Waterloo , Technical Program Committee , High Density Packaging User Group , Dieter Bergman Memorial Scholarship , Mechatronics Engineering , Conductive Anodic Filament , Electrochemical Migration , Metal Finishes , Solder Paste , Circuits Expo ,