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Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3D-IC prototyping, RF design, and partner collaboration / Key Highlights Ansys secured an award in the...
Siemens Digital Industries Software have announced new certifications and collaborations with TSMC, resulting in the successful qualification of multiple Siemens EDA product lines for the foundry’s latest process technologies.
Cadence digital full flow includes key new technologies, including a high-accuracy and massively scalable parasitic 3D field solver AI-powered Cadence Cerebrus enabled for N2 provides customers with productivity improvements Custom/analog flow based on AI-powered Virtuoso Studio supports circuit optimization and has been enhanced, providing up to 3X throughput for design migration Mutual customers actively designing…
Cadence Design Systems is making available new system prototyping flows based on the Cadence Integrity 3D-IC Platform that support the 3Dblox 2.0 standard.
ProteanTecs, a company specialising in deep data analytics for advanced electronics, has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance.