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GRENOBLE, France, Sept. 06, 2022 (GLOBE NEWSWIRE) -- Teledyne e2v announces the release of its 2-Megapixel Optimom™, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones,…

UP Bridge the Gap has partnered with Intel to release two new generations of robotic development kits to simplify robotics evaluation and development. UP Bridge the Gap is a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions.

In this article we try to provide you design software/tools companies offering product and support service to RISC-V based chip designs from small companies to biggest chip design experts such as Intel.

The engineers at UP Bridge the Gap have created two new robot developer kits thanks to a partnership with Intel.

UP Bridge the Gap has partnered with Intel to release two new generations of robotic development kits that look to simplify robotics evaluation and development.