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Share this article Share this article BEAVERTON, Ore., May 13, 2021 /PRNewswire/ -- To meet consumer demand for ever faster data downloads, from live streaming videos to global videoconferences, Tektronix, Inc. today announces three new testing solutions to help drive the future of data transfers. Tektronix announces three new testing solutions to help drive the future of data transfers. The new transmitter automated test solutions are designed to meet the demanding requirements of next-generation technologies for large, rapid data transfers and low-latency video displays. Tektronix USB4™,...

Saelig Introduces Teledyne LeCroy T3EL15030xP Programmable DC Electronic LoadsWith Wide-Ranging Test Capabilities The T3EL15030xPloads offer four modes (CC/CV/CR/CP) and transient testing for power and better testing needs Fairport, NY, USA: Saelig Company, Inc. has introduced the Teledyne LeCroy T3EL15030xP Programmable DC Electronic Loads – versatile test devices which feature four operating modes to provide wide ranging test capabilities. In Constant Current mode, the electronic loads will sink a constant current, regardless of the voltage at the device terminals. Its Constant Voltage...

Foxconn Announces FOXCONN NxVAE, Unsupervised Learning AI Technology Foxconn Technology Group, a global leader in smart manufacturing, announced the launch of FOXCONN NxVAE, a new unsupervised learning artificial intelligence (AI) technology that ensures higher levels of efficiency and accuracy in the inspection of defects in manufacturing production lines when compared with traditional practices. As a first step in applying this new technology, Foxconn introduced FOXCONN NxVAE to some handheld device production lines in main...

Elevate Semiconductor, San Diego, California — June 24, 2020. The mobile industry processor interface (MIPI®) standard defines industry specifications for the design of mobile devices such as smartphones, tablets, laptops and hybrid devices. MIPI interfaces play a strategic role in 5G mobile devices, connected car and Internet of Things (IoT) solutions. The MIPI standard defines three unique physical (PHY) layer specifications: MIPI D-PHY®, M-PHY® and C-PHY®. MIPI D-PHY and C-PHY physical layers support camera and display applications, while the high-performance camera, memory and chip-...