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Three-Dimensional Bonding of Energy Efficient Electronic Devices

At Osaka University, a new technique has been illustrated by the scientists for making three-dimensional integrated circuit connections that function at low temperatures and does not need external pressure. ....

Zheng Zhang , Osaka University , Integration Laboratory At Osaka University , Dimensional Bonding Of Energy Efficient Electronic Devices , Direct Three Dimensional Bonding , Energy Efficient Electronic , System Integration Laboratory , Study First Author ,