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Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company's focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions...

Panel Level Packaging production solutions drive scale production of newly architecture automotive ICs Dedicated Total Fab Solutions build high-efficiency production lines for FOPLP from pilot line to mass production solutions Build best-in-class Cu-plating uniformity and high current density to increase yields and throughput TAOYUAN, Taiwan, May 23, 2023 /PRNewswire/ -- Manz AG, a global high-tech engineering company with...