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Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain

Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity of Chip on Wafer on Substrate (CoWoS) packaging at TSMC.

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Camtek stock hits new heights as Israeli tech firm breaks $100 milestone

Specialized inspection systems manufacturer climbs over 265% in the last year following high demand from semiconductor and AI markets

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Samsung All Set To Commence Mass Production Of Its 3nm Exynos Chipset In The Second Half Of 2024, Claims New Report

A new report claims that Samsung will start mass production of its Exynos on the 3nm process in the second half of this year

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Google to switch to 3nm TSMC process for Pixel 10 s Tensor G5

Google to switch to 3nm TSMC process for Pixel 10 s Tensor G5
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Samsung Could Develop An Exynos 2400+ For The Upcoming Galaxy S24 FE; New SoC Could Bring Up To A 10 Percent Improvement In Power-Efficiency

Samsung is rumored to be working on a new Exynos 2400+ for the forthcoming Galaxy S24 FE, bringing in various improvements

Samsung exynosFan out wafer level packaging

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